Bending Fabrication Customized Parts
Tin and its alloy is a kind of coating with good weldability and
corrosion resistance. It is widely used in electronic components
and printed circuit boards. In addition to the physical methods
such as hot dipping and spraying, the methods such as
electroplating, dip plating and chemical plating have been widely
used in industry due to their simplicity.
Immersion tin plating
Dip plating is to dip the workpiece into the solution containing
the metal salt to be plated, and deposit the metal coating on the
surface of the workpiece according to the principle of chemical
replacement. This is different from the general principle of
electroless plating, because the solution does not contain reducing
agent. It is also different from contact plating, which means that
when the workpiece is immersed in the salt solution of the metal to
be plated, it must be closely connected with a reactive metal,
which is an anode entering the solution and releasing electrons.
The metal ions with higher potential in the solution get electrons
and deposit them on the surface of the workpiece. Dip tin is
applied only to iron, copper, aluminum and their respective
alloys.We use this method for coating the bending fabrication
customized parts.
Electroless tin
No reducing agent used for copper or nickel autocatalytic
deposition can be used to reduce tin. The simplest explanation is
that the hydrogen evolution overpotential on the surface of tin is
high, and the above reducing agent is hydrogen evolution reaction,
so it is impossible to reduce tin ions to tin. In order to
electroless tin plating, it is necessary to choose another kind of
hydrogen-independent strong reductants, such as Ti3+, V2+, Cr2+,
etc., only T3+/Ti4+ system has been reported.
Advantages:
1. Tin is reduced by divalence, saving electricity consumption;
2. Bath conductivity is high, bath voltage is low, high current
efficiency;
3. Operate the equipment close to room temperature without heating;
4. Luster coating can be obtained by using appropriate additives;
5. Less damaging to the substrate.
